Have you stopped by Spansion.com lately?

Have you noticed something different at spansion.com?  Based on some great information we collected from our customers over the past year, we undertook the task of redesigning our website to make it easier to find the exact information you require.  We have a brand new look, updated content, and reorganized information.

Accessible on the Front Page

We have placed the three most important sections readily accessible on the front page: the Support Center, Ask Spansion and Product Finder.  The Support Center has all the necessary materials from applications notes, packaging information, datasheets and software downloads making it easy to integrate Spansion® Flash Memory into your design.

Ask Spansion connects you directly to our experts so you can get quick resolution to your questions by either asking us directly or searching our extensive knowledgebase.  We have also significantly enhanced our search capabilities and display of results in the Product Finder section to make it faster to find the correct solution for your requirements.

Redesigned Product and Application Pages

We have completely redesigned our product and application sections.  On our product pages, we have introduced tabbed browsing within the body of the page.  You can now easily find the relevant supporting materials for the product you are currently exploring without having to leave the page.

Our applications section has a greater focus on industry applications.  We now include the suggested products for each market based upon your design objectives.  For those given products, we provide quick links to critical product materials.  It’s all in the name of getting you the correct information as quickly as possible.

Next Up, Memory Matters!

The Memory Matters blog will be getting a little face life too.  We are updating the home page with links to the latest stories.  At a glance you can see the most recent posts and quickly find the information that you desire.

I hope you will find the new site to be more effective.  We plan to continue innovating Spansion.com so let us know your thoughts and other types of information or functionality you would like to see.

XiP on NOR Flash: Meet Your Microcontroller’s Main Memory

With the rising complexity of today’s mobile devices and embedded systems, developers are facing an increasingly challenging task to design efficient memory subsystems that maximize system performance.  NOR Flash often contains the boot code, operating system kernel, device drivers, middleware and other application-specific software and can result in megabytes of programs stored in non-volatile Flash memory. 

Where performance is essential, these programs are moved from non-volatile memory to faster RAM for execution.  However, where device size and cost are critical, an alternative approach known as Execute-in-Place (XiP) where the programs are executed directly from non-volatile memory is becoming increasingly popular.

Executing Code from NOR Flash

When using XiP, the non-volatile memory subsystem is constantly being accessed to retrieve program code and may potentially introduce memory bottlenecks into the primary execution path. Understanding the system architecture is critical to identifying any factors that affect memory performance and the resulting system performance.

System performance is often measured as the number of instructions per cycle (IPC).  A CPU that requires 4 cycles to execute an instruction has an ideal IPC of 0.25, but many factors influence the actual IPC with one in particular, a cache miss being critical for XiP.  A cache miss will stall the system as an instruction is fetched from memory, resulting in a lower IPC. Fortunately, due to a “locality of reference” in systems with level 1 and level 2 caches one can achieve cache hit rates over 99%. 

Because system performance is affected by the ability of the memory subsystem to fill the cache when there is a cache miss, there are several factors to consider:

  • Read Bandwidth: A high bandwidth bus is needed to minimize the overall read latency even though only a single cache line of memory is being read (typically 32 bytes).  In addition, the nature of application programs requires the ability to make small, fast memory accesses throughout the entire code region with minimum latency.Read bandwidth performance varies across bus interfaces and operating frequencies and must be balanced against pin count. Consider the performance of a low-pin count SPI-DDR NOR with an initial access time of 120ns.  It significantly outperforms Async Parallel NOR and is comparable to Page Mode NOR.  While Burst Mode Parallel NOR has the highest bandwidth, its advantage over SPI-DDR is minimized in a cache-based system.
  • Controller Latency: Initiating a read command incurs controller latency when dealing with address and protocol overhead, measured from the time the command is sent to the controller to when the controller returns the first byte of data.Controller latency is higher for SPI-DDR NOR, primarily due to the serialization of the command and address information required at the beginning of an SPI transaction.  This gap in performance closes significantly as the memory bus frequency is increased.  In many mobile and embedded systems a sub 200ns controller latency would provide adequate performance and allow SPI-DDR to be considered as a viable alternative to Parallel NOR.
  • Instant and Average CPU Stall Times: When the next instruction to execute is not available in the cache, it must be loaded from memory. The impact on system responsiveness from instant delay depends upon how often the cache misses; if the miss rate is very low, the system can usually tolerate a relatively higher instant delay.The impact of stall time on system performance depends upon the CPU clock frequency. For CPU operating frequencies from 100 MHz to 166 MHz, SPI-DDR also provides an acceptable stall response when compared with both Burst and Page NOR. When SPI-DDR is compared to Burst Mode devices, a system developer will need to consider whether the additional pins (30+) required for the higher performance Burst Mode interface are a desirable tradeoff.

So what is the overall effect these factors have on a system’s IPC?

A typical mobile or embedded system has a cache miss rate of less than 1%. With a system with a CPU operating at 166 MHz and a 66 MHz memory bus and a cache miss rate of 0.5%, both Burst Parallel NOR and SPI-DDR NOR have a minimal impact on IPC of 1 to 2%.  With a higher cache miss rate of 1%, Burst Parallel NOR provides an advantage by impacting the IPC by only 6% compared to 12% for SPI-DDR NOR. 

In high-performance systems, Burst Parallel NOR will continue to be the preferred solution; however for slightly lower performance systems, SPI-DDR provides an attractive, low pin count alternative.

Spansion Universal Footprint: Flexibility in Your Designs

We have all had the same experience.  We start down a home improvement project and halfway through we need a more powerful part.  After trudging to the local supply store and returning with the part, we find out it just doesn’t fit.

Fortunately, the same won’t be true with our Spansion NOR flash due to our Universal Footprint. With consistent footprints and pinouts across product families, process technologies and densities, system architects can swap memory devices at any point in the product life cycle without affecting the PCB layout. Now that’s optimum flexibility that combines scalability with ease of design.

Faster Time-To-Market and Reduced System Costs

With interoperability between high-performance and price-performance NOR Flash products, one can build an entire family of products from a single platform design concept.  In addition to minimizing PCB rework and re-spin, designers can get multiple products in a family to market quicker and at effective price points.

Moreover, Spansion’s Universal Footprint offers supply chain and support benefits.  A single footprint can service multiple platforms.  And qualifying multiple products in the same footprint can increase product choice and scalability. By offering this flexibility, one can minimize the total system cost over the life of the product.

Flexible Packaging Options – Packing More Into Less

With our TSOP packaging options, the 56-pin TSOP package is a superset of the 48-pin TSOP. Both packages feature the same 48-pin core with consistent addressing, enabling board designs supporting densities from 2Mb to 4Gb. Our newly-released Spansion FL-S family with its serial parallel interface has 8-pin and 16-pin SO, 24-ball BGA and USON/WSON options that can scale in various configurations from as little as 4Mb to over 1Gb in capacity.

This packaging flexibility combined with Spansion’s commitment to provide a long-term stable supply of components makes Spansion NOR flash ideal for embedded system applications. In addition to the functionality and performance of the product, one can be assured that the manufacturability and support will meet the same levels of excellence. This is the single-most consistent feedback we get from our customers across all segments and applications.

Learn more about the Universal Footprint at our website.